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The Hybrid Memory Cube Consortium have been formed by Samsung, Micron Technology, Altera ,IBM, OpenSilicon, and Xilinx to design and promote specifications for the new Hybrid Memory Cube (HMC) memory technology.

The consortium says the technology can keep one step ahead of traditional DDR3 DRAM in several features and aims to be a better alternative to DDR4.

HMC uses high-speed logic processes built on a logic layer with several DRAM, laid at the top of it to create cube-like stacks
of memory that can supposedly deliver “15 times the performance of a DDR3 module” while simultaneously “utilizing 70 percentage less energy per bit than DDR3 DRAM,” according to Hybridmemorycube.org.
Stacked DRAM + Logic = Hybrid Memory Cube

Micron teamed with Intel to create the technology.

“ The industry consortium will help drive the fastest possible adoption of the technology, resulting in… radical improvements to computing systems,” says Micron VP Robert Feurle.

HMC ideal for smartphones, tablets, Ultrabooks, set top boxes,etc.
HMC is expected to release at 2013.